All components are fabricated using precision forming, microstructure processing, or specialized interface control technologies (e.g., fiber drawing, microhole array processing, integrated optical absorption layer coating, etc.). Critical structural dimensions and interface thicknesses are controlled at the micron or even submicron scale to ensure high resolution imaging.

Performs functions including optical signal input/output, image inversion/scaling, stray light suppression, electron multiplication, and signal collimated transmission, forming a complete signal path from weak light input to amplified electrical output.

Features matched thermal expansion coefficients, high-temperature baking resistance (≥450 °C), and tight control over distortion and displacement, enabling reliable long term imaging under the high voltage electric fields and temperature variations inside image intensifier tubes.

Key specifications including transmittance, gain, dark spots, and distortion are strictly controlled, directly defining the limiting resolution, signal to noise ratio, gain uniformity, and dynamic range of the image intensifier.